OCP Summit 2026: Powering AI with Open Innovations in Scale-Up, Scale-Out, and Scale-Across Networks
At the 2026 Open Compute Project Global Summit, Meta is sharing the next generation of open networking infrastructure, including: Our first liquid-cooled network rack (IcePack), and 102.4T switch platform (IceCube).
Executive Summary
At the 2026 Open Compute Project Global Summit, Meta is sharing the next generation of open networking infrastructure, including: Our first liquid-cooled network rack (IcePack), and 102.4T switch platform (IceCube). Flattened Planar Fabric (FPF), a multiplane backend scale-out fabric that fundamentally changes how GPUs connect to the network MetaRoCE, our open-source AI transport protocol.
Open Silicon & Gate-Level Hardware Inspection
From a silicon and hardware engineering viewpoint: - **Interface Neutrality:** Mitigates dependency on proprietary BSPs, empowering open toolchains to address hardware directly. - **Supply Chain Verification:** Schematics and open pinouts allow deterministic audits against silicon errata. - **Lifecycle Decoupling:** Decouples physical hardware utility from commercial vendor end-of-life obsolescence.
Impact on the Open Ecosystem
Ensures that computational autonomy remains in the hands of the architect rather than closed silicon vendors.