ADLINK I-Pi OSM IMX95 dev kit ships with Yocto Linux, i.MX95 NPU
ADLINK's $595 I-Pi OSM IMX95 industrial dev kit pairs a solder-down OSM 1.2 module with NXP's six-core i.MX95 processor and 2 TOPS NPU on a 4-inch carrier board.
Summary
ADLINK has released the I-Pi OSM IMX95, an industrial Linux development kit built around NXP's i.MX95 application processor. The kit combines a solder-down OSM-IMX95 computer-on-module with the OSM-EB4 carrier board, targeting edge AI and embedded industrial applications. Software support includes a Yocto Linux BSP with kernel 6.6 and Wayland, plus source availability through ADLINK's GitHub repository.
Hardware and software details
- Processor: NXP i.MX95 with six Arm Cortex-A55 cores, Cortex-M7 and Cortex-M33 microcontrollers, Mali-G310 GPU, and eIQ Neutron N3 NPU (2 TOPS)
- Memory/Storage: 4GB soldered LPDDR4, 32GB eMMC; module family supports up to 8GB/256GB
- Module: 45 × 45mm OSM Size-L, SGeT OSM 1.2 spec, solder-down LGA design without board-to-board connectors
- Carrier: 165 × 115mm OSM-EB4 with dual Gigabit Ethernet (TSN), HDMI/LVDS/MIPI-DSI, MIPI-CSI, M.2 M-key (PCIe Gen3)
- I/O: 5× UART, 3× SPI, 2× I2C, 14× GPIO, 4× PWM, 2× ADC, 2× CAN FD; 2× USB 3.0, 2× USB 2.0 host, 1× USB 2.0 OTG
- Software: Yocto Linux BSP (Scarthgap), Linux 6.6, Wayland; UUU bootloader; meta-adlink-nxp repo on GitHub; Foundries.io Linux microPlatform also supported
- Industrial: IEC 60068 and MIL-STD-202 shock/vibration testing; 0°C to 60°C standard, -40°C to 85°C optional; 15-year product availability commitment
Why it matters
The solder-down OSM 1.2 form factor and 15-year availability commitment target long-lifecycle industrial deployments, while the open Yocto BSP with published source code and GitHub repository aligns with embedded Linux development practices.
Original reference: linuxgizmos.com →