Tria OSM-SB-EP5 carrier board supports NXP i.MX and Qualcomm IQ615 compute modules

Tria Technologies has introduced the OSM-SB-EP5, a development carrier board conforming to the Open Standard Module (OSM) 1.2 specification that accepts Size-S, Size-M, and Size-L compute modules. The platform supports multiple processor families including NXP's i.MX 93, i.MX 8M Plus, and i.MX 95, as well as Qualcomm's IQ615, enabling engineers to evaluate different SoCs before designing application-specific carrier boards.

The 146 × 102mm board provides dual Gigabit Ethernet, USB 3.0 Type-C with DisplayPort Alternate Mode, MIPI camera and display interfaces, CAN bus, and an M.2 Key-E expansion socket. It targets industrial IoT, edge AI, robotics, and embedded vision applications with an operating temperature range of -25°C to +85°C. Processor modules are available as engineering samples in OEM quantities, though pricing has not been disclosed.

Hardware architecture and module compatibility

• OSM form factor compliance: The carrier board follows the OSM 1.2 specification and accommodates Size-S, Size-M, and Size-L modules, including variants with components mounted on both sides.
• NXP i.MX 95 configuration: Six Cortex-A55 cores at up to 1.8GHz with integrated NPU, GPU, VPU, and ISP, paired with 8GB LPDDR5 and 32GB or 64GB eMMC storage.
• Qualcomm IQ615 configuration: Two Cortex-A76 plus six Cortex-A55 cores with 4GB or 8GB LPDDR4, 16GB or 64GB eMMC, and a TPM 2.0 security module.
• Networking and expansion: Dual RJ45 Gigabit Ethernet ports, 1000BASE-T1 Single Pair Ethernet, M.2 Key-E socket with PCIe x1/SDIO/USB 2.0/I²C/UART, and mikroBUS socket for peripheral modules.
• Industrial interfaces: Two CAN interfaces, four UART connections (RS-232/RS-485), two SPI buses, two I²C buses, 24 GPIO signals, two ADC channels, and five PWM outputs.

Why it matters

The OSM-SB-EP5 strengthens the open hardware ecosystem by providing a standardized evaluation platform that reduces vendor lock-in for embedded Linux development, allowing engineers to swap between NXP and Qualcomm modules without redesigning carrier board hardware. Its support for industrial temperature ranges and comprehensive interface selection makes it particularly relevant for Linux-based edge AI and robotics projects that require long-term hardware stability and upstream kernel compatibility across multiple SoC vendors.